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| d a t a sh eet preliminary speci?cation supersedes data of 1998 mar 17 file under integrated circuits, ic11 1999 dec 07 integrated circuits TEA1504 greenchip ? smps control ic
1999 dec 07 2 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 features distinctive features high level of integration reduces the number of components by up to 50 compared to power supply using discrete components on/off functional switch replaces expensive mains switch direct off-line operation (90 to 276 v ac) 5% accurate on-chip oscillator. green features low power consumption in off-mode (<100 mw) fast and efficient on-chip start-up current source burst mode standby (<2 w) for overall improved system efficiency low power operation mode with lower frequency reduces switching losses low overcurrent protection (ocp) level. protection features demagnetization protection cycle-by-cycle current limitation with programmable current trip level overvoltage protection overtemperature protection safe-restart mode with reduced power for system fault conditions. highly versatile usable in buck and flyback topology interfaces both primary and secondary side feedback. general description the greenchip ? TEA1504 is intended for off-line 90 to 276 v (ac) power supply applications. it is one of a family of high voltage ics integrating both analog and digital circuit functions for controlling a switched mode power supply (smps). its functions include integrated high voltage start-up current source, voltage pulse width mode (pwm) control, 5% accurate oscillator, band-gap derived reference voltages, comprehensive fault protection and leading edge blanking. its high level of integration allows power supplies to be cost effective, compact, lightweight, highly efficient, more reliable, and simple to design. efficient green features permit very low power operation modes, and an innovative on/off function allows an expensive mains switch to be replaced with a low-cost functional switch. the greenchip ? family the greenchip ? family of ics are fully integrated with most common pwm functions such as error amplifier, oscillator, bias current generator and band-gap based reference voltage circuits. the high level of integration allows easy and cost effective power supply design. the ics are made by a philips proprietary high voltage bcdmos process which produces low voltage circuit devices with inputs that are able to withstand up to 720 v. ordering information type number package name description version TEA1504 dip14 plastic dual in-line package; 14 leads (300 mil) sot27-1 1999 dec 07 3 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 block diagram handbook, full pagewidth start-up current source mgs569 burst mode stand-by on/off sample and hold1 sample and hold2 v aux management v aux demagnetization management oscillator over temperature protection over current protection leading edge blanking frequency control negative clamp inverting error amplifier duty cycle limiting signal driver stage comparator pulse width modulator v i ref oob ctrl q r 1 6 8 14 5.5 v 9 13 s dem hvs 2 n.c. 3 n.c. 10 n.c. 12 gnd 11 TEA1504 6 w 1 k w i sense 5 driver 4 6 w ds 7 fig.1 block diagram. 1999 dec 07 4 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 pinning symbol pin description v i 1 start-up current source input; connects to mosfet drain supply hvs 2 high voltage safety spacer n.c. 3 not connected driver 4 driver output; connects to gate of power mosfet i sense 5 current sense input; connects to current sense resistor v aux 6 ic supply; connects to supply capacitor ds 7 internal driver supply ref 8 reference input; connects to reference resistor for setting internal reference currents ctrl 9 duty cycle control input n.c. 10 not connected gnd 11 ground n.c. 12 not connected dem 13 demagnetization signal input oob 14 burst mode standby on/off control signal input handbook, halfpage mgs570 TEA1504 1 2 3 4 5 6 7 8 14 13 12 11 10 9 v i hvs n.c. driver i sense v aux ds ref ctrl n.c. gnd n.c. dem oob fig.2 pin configuration. functional description negligible power is dissipated by the TEA1504 after start-up, due to its fast and efficient start-up circuit. it has an accurate saw tooth oscillator whose output signal is compared with a voltage feedback control circuit to generate a pulse width modulated signal for driving the gate of an external power mosfet. the number of external components required for regulating the supply are reduced due to an innovative design implementing both primary and secondary side regulation. overvoltage, overcurrent, overtemperature and demagnetization features protect the ic from system fault conditions. off-mode, burst mode standby, and a low power operation mode are advanced features that greatly enhance the efficiency of the overall system. off-mode, reduces the power consumption of the ic below 100 mw. burst mode standby, reduces the power consumption of the system to below 2 w. low power operation mode, reduces the operating frequency of the system during low load conditions to reduce switching losses. start-up current source and v aux management a versatile on-chip start-up current source eliminates the need for an external, highly dissipative trickle-charge circuit. see figs 1 and 3. the start-up current source is supplied by rectified mains power via v i (pin 1). it supplies charging current to the ic supply capacitor (c aux ) and also supplies current to the ic control circuit (v aux management) (see i start(vaux)l and i start(vaux)h in chapter characteristics). once c aux is charged to its start-up voltage level (11 v), the oscillator starts oscillating and the ic starts switching the power mosfet. power is then supplied to the load via the secondary winding. c aux is also supplied by an auxiliary winding on the primary side which is coupled to the secondary winding supplying the output capacitor (c o ). as the voltage on c o increases and approaches its nominal value, c aux is re-supplied with current by the auxiliary winding (see fig.4). for correct operation, it is important that c aux starts to be re-supplied with current by the auxiliary winding before its voltage drops to the under voltage lockout (uvlo) level of 8.05 v. 1999 dec 07 5 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 the start-up current source also helps to implement the safe-restart or hiccup mode required during system fault conditions: output short-circuit, output open-circuit, and overvoltage. under these fault conditions, the ic inhibits the normal operation of the system and stops delivering output power. if the output is short-circuited, c aux is no longer supplied by the auxiliary winding and its voltage drops to the uvlo level. if the output open-circuits, the output voltage rises to the overvoltage protection (ovp) level. the ic detects this state and stops switching the power mosfet, which stops re-supplying current to c aux whose voltage starts to drop. once the voltage on c aux drops to the uvlo level, the start-up current source re-activates and charges c aux to the start-up level, and the system begins the safe-restart mode cycle, similar to the normal start-up cycle. figure 5 shows the relevant waveforms during safe-restart mode. to achieve a low hiccup duty cycle, the current charging c aux during the safe-restart mode is lower than it is during normal start-up (see i restart(vaux) and i start(vaux)h in chapter characteristics). this reduces the risk, during an output short-circuit condition, of any physical damage being caused to output secondary winding devices, and of any breach of safety. the start-up current source is also important for implementing burst mode standby, explained in section burst mode standby (see i restart(vaux) in chapter characteristics). handbook, full pagewidth mgs571 v mains auxiliary winding TEA1504 1 (1) 2 3 4 5 6 7 8 14 13 12 11 10 9 v i v o c o c aux r ref r sense hvs n.c. driver power mosfet i sense v aux ds ref ctrl n.c. gnd n.c. dem oob c ctrl r dem fig.3 typical flyback application. (1) secondary earthing points are isolated from their primary earthing points. 1999 dec 07 6 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 reference all reference voltages are derived from a temperature compensated, on-chip, band-gap. the band-gap reference voltage is also used with an external resistor (r ref ) connected to ref (pin 8), to generate accurate, temperature independent, ic internal bias currents. . r ref also affects the frequency of the oscillator (see section oscillator). sample-and-hold the TEA1504 uses voltage feedback with an innovative sample-and-hold circuit to regulate the output voltage. in a primary feedback configuration, the sample-and-hold circuit samples the current into dem (pin 13), fed by r dem , which relates to the output voltage (v o ) during the period that current flows in the secondary winding. av o =i ref r dem +v clamp(dem)(pos). v clamp(dem)(pos) is specified in chapter characteristics; a = a constant determined by the turns ratio of the transformer. the sampled current is held in the external capacitor (c ctrl ). the pwm uses the voltage on c ctrl to set the operating duty cycle of the power mosfet. when the TEA1504 is used in a secondary feedback configuration, the feedback voltage is provided by an opto-coupler. mgs572 t t (4) (2) (3) (1) 11 v 8.05 v v vaux v o t v g (power mosfet) switching off fig.4 normal start-up waveforms. (1) start-up current source charges c aux . (2) start-up voltage. (3) uvlo level. (4) auxiliary winding charges c aux . i ref v ref r ref ------------- - a [] = handbook, full pagewidth mgs647 t t fault condition switching off (1) normal operation v vaux v g (power mosfet) fig.5 safe-restart mode waveforms. (1) start-up current source charges c aux . 1999 dec 07 7 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 pulse width modulator the pwm comprises an inverting error amplifier and a comparator (see fig.1) which drives the power mosfet with a duty cycle that is inversely proportional to the voltage at ctrl (pin 9). a signal from the oscillator sets a latch that turns on the power mosfet. the latch is then reset either by the signal from the pwm or by a duty cycle limiting signal from the oscillator. the latch stops the power mosfet from being switched incorrectly if the pwm output signal becomes unstable. the maximum duty cycle is internally set to 80%. the ic switching signals during normal operation are shown in fig.7. oscillator the oscillator determines the switching duty cycle. its ramp signal voltage is compared to the output of the error amplifier by the pwm. the fully integrated oscillator circuit works by charging and discharging an internal capacitor between two voltage levels to create a sawtooth waveform with a rising edge that is 80% of the oscillator period (high frequency mode). this ratio sets a maximum switching duty cycle of 80% for the ic. the accuracy of the oscillator frequency is internally set to 5%. its frequency can be adjusted between 50 and 100 khz by changing the value of r ref . this gives the power supply designer greater flexibility in the choice of system components. the relationship between frequency and the value of r ref is shown in fig.6. the range of r ref values and the frequencies of f oscl and f osch are specified in chapter characteristics. multi frequency control when the power supply operates at or below 1 9 of its peak power, the ic changes to low power operation mode. this lowers the frequency of the oscillator to reduce the power supply switching losses. the ratio between the high and the low oscillator frequency is maintained at 1 : 2.5 (see f oscl in chapter characteristics). an innovative design ensures that the transfer from high-to-low frequency and vice versa does not effect output voltage regulation. gate driver the driver circuit to the gate of the power mosfet has a totem-pole output stage that has current sourcing capability of 120 ma and a current sink capability of 550 ma. this permits fast turn-on and turn-off of the power mosfet for efficient operation. this circuit design allows the power supply designer to control the source and sink currents of the gate driver circuit with a minimum number of external components. a low driver source current has been chosen in order to limit the d v/ d t at switch-on. this reduces electro magnetic interference (emi) and also the current spike across r sense . demagnetization protection the demagnetization protection feature ensures discontinuous conduction of the power supply, simplifying the design of feedback control and giving a faster transient response. it protects against saturation of the transformer/inductor and also protects the power supply components against excessive stresses at start-up, when all energy storage components are completely discharged. during a system output short-circuit fault condition, it provides cycle-by-cycle protection of the converter configuration. the demagnetization resistor (r dem ) value can be calculated using the formula given in section sample-and-hold. negative clamp the negative clamp circuit ensures correct operation of the ic by preventing the voltage at dem (pin 13) dropping below - 0.45 v, during the period when the power mosfet turns on and the auxiliary winding voltage goes negative. handbook, halfpage 10 20 30 40 110 90 50 30 70 mgs573 r ref (k w ) f osch (khz) 55 45 25 15 35 f oscl (khz) (2) (1) fig.6 frequency as function of r ref value. (1) high frequency mode. (2) low frequency mode. 1999 dec 07 8 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 handbook, full pagewidth v vi v vi v d (power mosfet) v o v vaux i vaux v oob v m c 0 0 (1) start-up sequence normal operation normal operation overvoltage protection output short circuit burst mode stand-by mgs574 v g (power mosfet) fig.7 typical waveforms. (1) all negative currents flow out of the ic. 1999 dec 07 9 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 overvoltage protection the ovp circuit senses the voltage at v aux (pin 6). if the output voltage exceeds the preset voltage limit, the ovp circuit turns off the power mosfet preventing the re-supply of current to c aux .v vaux drops to the uvlo level and the system enters the low dissipation safe-restart mode described earlier. the system recovers from the safe-restart mode only if the ovp condition is removed. overcurrent protection cycle-by-cycle ocp is provided by sensing the voltage on r sense . the voltage on r sense relates to the amplitude of the primary current, and is internally compared with a reference voltage using a high speed comparator. the comparator threshold voltage is specified as v th(isense) in the chapter characteristics. the maximum primary (protection) current is therefore: . if the power mosfet current exceeds the current limit, the comparator changes state, turning off the power mosfet. the power mosfet is typically turned off in 210 ns (see t d(isense-driver) in chapter characteristics). having r sense off-chip allows the power supply designer greater flexibility for programming the ocp threshold level. it also reduces the risk of an overcurrent condition being sensed incorrectly. when the power mosfet turns on, the discharge current from the demagnetization d v/ d t limiting capacitor, flows through the power mosfet instead of through r sense . the leading edge blanking circuit inhibits the operation of the ocp comparator for a short period when the power mosfet turns on (see t blank(le) in chapter characteristics). this ensures that the power mosfet is not turned off prematurely due to the false sensing of an overcurrent condition caused by current spikes produced by the discharge of primary-side snubber and parasitic capacitances. the t blank(le) is not fixed and tracks the oscillator frequency. overtemperature protection overtemperature protection is provided by an analog temperature sensing circuit which turns off the power mosfet when the temperature exceeds typically 140 c. on/off mode the on/off mode allows an expensive mains switch to be replaced by an in-expensive functional switch. figure 8 shows a flyback converter configured to use the on/off mode. switch s1 connects oob (pin 14) to either a voltage close to ground, or to a voltage typically greater than 2.5 v. the oob voltage is detected internally by the ic. if v oob is low, the ic enters the off-mode, consuming a current of typically 350 m a (see i off(vi) in chapter characteristics). if v oob is typically 2.5 v, the ic enters the start-up sequence and begins normal operation (see v th(on/off) in chapter characteristics). figure 9 shows a mains under voltage lock out (muvlo) circuit using 3 resistors. assuming that r3 is chosen to be a very high value, the ic starts operating when: ; where r1 >> r2. this ensures that the power supply only starts working above a v mains of 80 v for example. the bleeder current through r1 should be low (e.g. 30 m a at 300 v). burst mode standby oob (pin 14) is also used to implement the burst mode standby. in burst mode standby, the power supply enters a special low dissipation state where it typically consumes less than 2 w of power. figure 9 shows a flyback converter using the burst mode standby function. the system enters burst mode standby when the microcontroller closes switches s2 and s3 on the secondary side. switch s2 connects the output secondary winding to microcontroller capacitor (c m c ) bypassing c o . when the voltage on (c m c ) exceeds the zener voltage, the opto-coupler is activated sending a signal to oob. in response to this signal, the ic stops switching and enters a hiccup mode. figure 7 shows the burst-mode standby signals. the hiccup mode during burst mode standby operation differs from the hiccup mode in safe-restart mode during a system fault condition. for safe-restart mode, the power has to be reduced. burst mode standby requires sufficient power to supply the microcontroller. to prevent transformer rattle, the transformer peak current is reduced by a factor of 3. burst mode standby operation continues until the microcontroller opens switches s2 and s3. the system then enters the start-up sequence and begins normal switching behaviour. i prot v th isense () r sense -------------------------- - a [] = v mains r1 r2 ------- - v oob v [] ? 1999 dec 07 10 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 limiting values in accordance with the absolute maximum rating system (iec 60134); note 1. notes 1. all voltages are referenced to gnd (pin 11). 2. equivalent to discharging a 100 pf capacitor through a 1.5 k w series resistor. 3. equivalent to discharging a 200 pf capacitor through a 0.75 mh coil. thermal characteristics quality specification quality specification snw-fq-611 part e is applicable. symbol parameter conditions min. max. unit v i dc voltage on pin v i measured at 200 m a - 720 v v oob voltage on pin oob - 0.3 +14 v i dem current on pin dem - 1ma v ctrl voltage on pin ctrl - 0.3 +5 v v lsense voltage on pin i sense - 0.3 +5 v i ref current on pin ref -- 1ma v vaux voltage on pin v aux - 0.3 +18 v v ds voltage on pin ds - 0.3 +18 v t j junction temperature - 10 +140 c t stg storage temperature - 40 +150 c v esd electrostatic discharge class 1 human body model note 2 - 1250 v machine model note 3 - 200 v symbol parameter value unit r th(j-a) thermal resistance from junction to ambient 70 k/w 1999 dec 07 11 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 characteristics t j = - 10 to +110 c; v vi = 300 v; r ref = 24.9 k w (0.1%); v vaux = 8.6 to 13 v. positive currents ?ow into the ic. negative currents ?ow out of the ic. all voltages are referenced to gnd (pin 11). symbol parameter conditions min. typ. max. unit start-up current source and v aux management (pins 1 and 6) v start(vi)(min) minimum start-up voltage on v i 100 -- v v start(vaux) start-up voltage on v aux 10.4 11 11.6 v v uvlo(vaux) under-voltage lockout on v aux 7.4 8.05 8.6 v v hys(vaux) hysteresis voltage on v aux v start(vaux) - v uvlo(vaux) 2.60 2.95 3.30 v i i(vi) input current on v i normal operation 20 60 100 m a i off(vi) off mode current on v i v oob < 1.95 v 150 350 550 m a i start(vaux)l low start-up current on v aux 0v 1999 dec 07 13 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 application information a converter using the TEA1504 is usually either a flyback or a buck converter that comprises emi filter, full bridge rectifier, filter capacitor, transformer, output stage(s) and some snubber circuitry. depending upon the type of feedback used, either an auxiliary winding (primary regulation) or an opto-coupler (secondary regulation) is used. very few external components are used due to the high level of chip integration. a sense resistor (r sense ) converts the primary current into a voltage at i sense (pin 5). the ic uses this voltage to set the peak current of the converter. an auxiliary winding supplies capacitor c aux which buffers the ics internal supply. the auxiliary winding is also used as part of the primary output voltage regulation circuit. a resistor (r ref ) determines the ics reference currents into ref (pin 8). a capacitor (c ctrl ) having a low value of typically 0.2 to 2 nf is used by the internal sample-and-hold circuit to regulate the primary feedback circuit. c ctrl is connected to ctrl (pin 9). this pin is also the input for the opto-coupler signal in a secondary sensing configuration. pin 11 is connected to ground. the primary side auxiliary winding is connected by resistor (r dem ) to dem (pin 13). the dem input is also used for primary side regulation. input oob (pin 14) implements both the on/off and the burst mode standby functions. the supply connected to v i (pin 1) is used by the internal start-up current source for charging capacitor c aux during start-up and safe-restart modes. for additional information also see: application note an98011: 200 w smps with TEA1504 . handbook, full pagewidth mgs575 v mains s1 output on/off mode switch auxiliary winding TEA1504 1 (1) 2 3 4 5 6 7 8 14 13 12 11 10 9 v i v o c o c aux r ref r sense r dem hvs n.c. driver power mosfet i sense v aux ds ref ctrl n.c. gnd n.c. dem oob r ctrl (1) fig.8 typical flyback configuration with secondary sensing and on/off feature. (1) secondary earthing points are isolated from their primary earthing points. 1999 dec 07 14 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 handbook, full pagewidth mgs576 v mains r1 r2 s2 s3 output on/off mode switch burst-mode stand-by on/off from microcontroller auxiliary winding s1 r3 TEA1504 1 (1) (1) 2 3 4 5 6 7 8 14 13 12 11 10 9 v i v o v m c c m c c o c ctrl r ctrl r4 c aux r ref r sense r dem hvs n.c. driver power mosfet i sense v aux ds ref ctrl n.c. gnd n.c. dem oob fig.9 flyback configuration with secondary sensing using the burst mode standby and on/off feature. (1) secondary earthing points are isolated from their primary earthing points. 1999 dec 07 15 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 handbook, full pagewidth mgs577 v mains TEA1504 1 2 3 4 5 6 7 8 14 13 12 11 10 9 v i v o c o c aux r ref r ctrl r sense hvs n.c. driver power mosfet i sense v aux ds ref ctrl n.c. gnd n.c. dem oob r dem s1 output on/off mode switch fig.10 typical buck configuration with secondary sensing. 1999 dec 07 16 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 handbook, full pagewidth mgs578 v mains TEA1504 1 2 3 4 5 6 7 8 14 13 12 11 10 9 v i v o c o c aux r ref r sense hvs n.c. driver power mosfet i sense v aux ds ref ctrl n.c. gnd n.c. dem oob c ctrl r dem s1 output on/off mode switch fig.11 typical buck configuration with primary sensing. 1999 dec 07 17 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 package outline unit a max. 1 2 (1) (1) b 1 cd (1) z ee m h l references outline version european projection issue date iec jedec eiaj mm inches dimensions (inch dimensions are derived from the original mm dimensions) sot27-1 92-11-17 95-03-11 a min. a max. b max. w m e e 1 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.2 4.2 0.51 3.2 0.068 0.044 0.021 0.015 0.77 0.73 0.014 0.009 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.087 0.17 0.020 0.13 050g04 mo-001aa m h c (e ) 1 m e a l seating plane a 1 w m b 1 e d a 2 z 14 1 8 7 b e pin 1 index 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. dip14: plastic dual in-line package; 14 leads (300 mil) sot27-1 1999 dec 07 18 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 soldering introduction to soldering through-hole mount packages this text gives a brief insight to wave, dip and manual soldering. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). wave soldering is the preferred method for mounting of through-hole mount ic packages on a printed-circuit board. soldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. manual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. suitability of through-hole mount ic packages for dipping and wave soldering methods note 1. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. package soldering method dipping wave dbs, dip, hdip, sdip, sil suitable suitable (1) 1999 dec 07 19 philips semiconductors preliminary speci?cation greenchip ? smps control ic TEA1504 definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation. ? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the 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400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2886, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 62 5344, fax.+381 11 63 5777 printed in the netherlands 295002/02/pp 20 date of release: 1999 dec 07 document order number: 9397 750 05331 |
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